Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...

– SCHMID accompanies production change-over and takes care of downstream processes. The wafers of the future are getting thinner and thinner and already approaching a thickness of 140 µm. The slurry ...

The German tooling firm announces the development of a new texturing process for multicrystalline wafers using diamond wire sawing on its LINEX inline system. Company believes process can boost multi ...

[Asia Economy Reporter Hyungsoo Park] Semiconductor equipment company Hanmi Semiconductor announced on the 14th that it has developed the 'Full Automation Wafer Micro SAW W1121,' a wafer cutting saw ...

DUBLIN--(BUSINESS WIRE)--The "Global Wafer Dicing Saws Market 2017-2021" report has been added to Research and Markets' offering. The global wafer dicing saws market to grow at a CAGR of 6.35% during ...

Semiconductors guarantee high resistance, low cost, and reliability when used in electronic circuits. To manufacture semiconductor devices, multiple photographic and chemical-processing steps are ...

VTT completes the conversion of its cleanroom equipment in the Micronova cleanroom to 200mm silicon wafer size.

FREMONT, CA / ACCESS Newswire / / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced a strategic partnership with ISE Labs, Inc., a ...