SUNNYVALE, CA – Synopsys has officially completed its acquisition of Ansys, finalizing a deal first announced in January of last year. The move combines Synopsys’ strengths in silicon design and IP ...

A step-down PCB is simply a multilayer PCB whose board thickness is reduced (stepped down) in a few places. The step-down is ...

SANTA ANA, CA – TTM Technologies has announced the acquisition of a 750,000 sq. ft. facility in Eau Claire, WI, and land rights for a new manufacturing site in Penang, Malaysia.

WASHINGTON – Global semiconductor sales reached $59 billion in May, a 27% year-over-year increase, according to data released today by the Semiconductor Industry Association (SIA). Sales were up 3.5% ...

PEACHTREE CITY, GA – CIRCUITS ASSEMBLY today announced the 2025 New Product Introduction (NPI) Award winners for electronics assembly equipment, materials and software. The 18th annual NPI Awards ...

How will the pandemic play out in the PCB world? Here we are, nine months into 2020, with little insight as to how the rest of the year will turn out for printed circuit fabricators. When was the last ...

ATLANTA, GA – After a steep projected decline in April, component industry sentiment stabilized in May, according to just-published results from ECIA’s Electronic Component Sales Trend (ECST) survey.

SEOUL – Doosan Corp. has launched mass production at its new flexible copper-clad laminate (FCCL) plant in Gimje, North Jeolla Province, targeting the fast-growing foldable smartphone and wearable ...

GIMJE, KOREA – Doosan has opened a flexible copper-clad laminate (FCCL) plant here at the Horizon Industrial Complex. The new plant covers 13,000 sq. m. of the 82,211 sq. m. site on which it was built ...

MacDermid Enthone invests in RM Plating to boost advanced surface finishing solutions for Latin American industries like automotive and construction.

HANGZHOU, CHINA – Chinese copper-clad laminate provider Wazam New Materials said it plans to invest up to $60 million to build a factory in Thailand. The company said it will establish a project ...

Yole Group forecasts the advanced IC substrate market to reach $31B by 2030, fueled by AI, glass core substrates, and demand for complex high-performance packaging.