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SUNNYVALE, CA – Synopsys has officially completed its acquisition of Ansys, finalizing a deal first announced in January of last year. The move combines Synopsys’ strengths in silicon design and IP ...
A step-down PCB is simply a multilayer PCB whose board thickness is reduced (stepped down) in a few places. The step-down is ...
SANTA ANA, CA – TTM Technologies has announced the acquisition of a 750,000 sq. ft. facility in Eau Claire, WI, and land rights for a new manufacturing site in Penang, Malaysia.
WASHINGTON – Global semiconductor sales reached $59 billion in May, a 27% year-over-year increase, according to data released today by the Semiconductor Industry Association (SIA). Sales were up 3.5% ...
Yole Group forecasts the advanced IC substrate market to reach $31B by 2030, fueled by AI, glass core substrates, and demand for complex high-performance packaging.
Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Software-defined tools and virtualization are key to scaling networks for 5G, 6G, and future latency-critical applications like AR, autonomous vehicles, and smart factories.
Rebuilding the industrial base will take time and commitment. There has been a lot of talk, chatter, posturing and proclamations by pundits and politicians alike about the soon-to-be American ...
Cloud-based collaboration prevents costly errors in PCB design by improving version control, team efficiency, and real-time data access across remote teams.
Analog design remains critical in a digital world, demanding precise placement, shielding, and memory tuning for performance in modern RF, IoT, and DDR applications.
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