The 2D devices fabricated using CDimension’s ultra-thin films have demonstrated up to a 1,000X improvement in ...
Biocomputing research is testing living neurons for computation as scientists look for energy-efficient alternatives to ...
Key market opportunities in the Gallium Nitride (GaN) transistor sector include enhancing power efficiency and density, strategic innovation in design and packaging, and leveraging resilient supply ...
The EPC2366 40 V eGaN® FET sets new benchmarks in performance, efficiency, and power density for next-generation power electronics. The EPC2366 showcases our ongoing commitment to help engineers ...
In one instance, to further enhance output voltage swing and linearity, the authors propose a novel “breakdown-voltage (BV) ...
AI amplifies whatever we bring to it—wisdom or folly, compassion or callousness. Will human greed get the better of us, or ...
ZHUHAI, GUANGDONG, CHINA, January 21, 2026 /EINPresswire.com/ -- Environmental responsibility has transitioned from ...
The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.
Rohde & Schwarz invites the global electromagnetic compatibility (EMC) community to join a crucial discussion on preparing ...
Taiwan Semiconductor Manufacturing Co. is building a $165 billion facility in north Phoenix to mass-produce advanced semiconductors. Semiconductors, often called chips, are the electronic "brains" ...
Through cosmetic and functional enhancements, the iPhone 18 Pro models may address several lingering shortcomings.
Interesting Engineering on MSN
China’s new flexible fibre chip can survive being run over by a 15.6-ton truck
Researchers from Fudan University in China have reportedly developed a new flexible chip fibre ...
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